Low Coefficient of Linear Thermal Expansion Polyimide Film for Device Substrate.

Presentation information

Symposium

Symposium planned by Program Committee » Flexible Electronics

Tue. Mar 18, 2014 1:30 PM - 4:30 PM D9 (D315)

2:00 PM - 2:30 PM

^○Tetsuo Okuyama¹, Kousuke Sasai¹, Katsuki Nakase¹, Kazuyuki Oya¹, Muneatsu Nakamura¹ (Toyobo Co., Ltd Research Center¹)

Keywords:ポリイミド　,フレキシブル,CTE