The 61st JSAP Spring Meeting, 2014

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13. Semiconductors A (Silicon) » 13.3 Si Process・Interconnect・MEMS・Integration

[18p-E14-1~21] 13.3 Si Process・Interconnect・MEMS・Integration

Tue. Mar 18, 2014 1:15 PM - 6:45 PM E14 (E302)

1:30 PM - 1:45 PM

[18p-E14-2] Application of electrophoretic deposition of nano-particles to high-speed via filling

○Ryo Takigawa1, Kiyoaki Nakahara1, Takanori Shuto1, Akihiro Ikeda1, Tanemasa Asano1 (Kyushu University1)

Keywords:TSV