The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[13a-1C-1~10] 13.4 Si wafer processing /MEMS/Integration technology

Sun. Sep 13, 2015 9:00 AM - 11:45 AM 1C (135)

座長:河本 直哉(山口大),松尾 直人(兵庫県立大)

11:00 AM - 11:15 AM

[13a-1C-8] Formation of Single Crystalline Silicon with Midair Cavity for Meniscus Force-Mediated Local Layer Transfer

〇Muneki Akazawa1, Seiichiro Higashi1 (1.Hiroshima Univ.)

Keywords:transfer,single crystalline silicon,glass

We attempted to control size and shape of the SiO2 column supporting the SOI layer by implantation for improvement of transfer yield. The column size was controlled by etching time and the minimum size was 104 nm. In case of implanted samples, the transfer yield of SOI layers was significantly improved to 95% under a condition of P+ dose of 1 × 1015 cm-2 by optimizing the column size and shape.