The 76th JSAP Autumn Meeting, 2015

Presentation information

Symposium

Symposium » Progress of semiconductor wet processing - from silicon to compound -

[13p-1B-1~10] Progress of semiconductor wet processing - from silicon to compound -

Sun. Sep 13, 2015 1:15 PM - 5:45 PM 1B (133+134)

座長:真田 俊之(静岡大)

1:30 PM - 2:15 PM

[13p-1B-2] The person who controls power controls the future. - Si, SiC and GaN -

〇Takashi Yunogami1 (1.Fine Processing Institute)

Keywords:semiconductor,power consumption,wet cleaning technology

We have to solve "a problem of power" so that semiconductor industry grows up. About a Si semiconductor, reducing power consumption of smart-phone and data center is the greatest problem. For effective power supply, SiC and GaN which can be superior to Si in materials properties are necessary. However, we must finally realize a low cost to spread SiC and GaN. Wet cleaning technology realized "yield more than 90%" in Si semiconductor and contributed to a surprising low cost. The wet cleaning technology will be useful for yield improvement in SiC and GaN.