[13p-1B-1~10] Progress of semiconductor wet processing - from silicon to compound -

[13p-1B-8] Challenge of Japan Sonic device miniaturization cleaning

〇Yoshiharu Yamamoto¹ (1.Yamato Technos)

Keywords:Semiconductor wafer cleaning equipment

1)Features of Japan Sonic
a)Cleaning wafer by foaming cleaning solution is possible
b)Miniaturization cleaning is possible