The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[13p-1C-1~15] 13.4 Si wafer processing /MEMS/Integration technology

Sun. Sep 13, 2015 1:15 PM - 5:15 PM 1C (135)

座長:鉄田 博(日新イオン機器),上野 和良(芝浦工大)

2:15 PM - 2:30 PM

[13p-1C-5] Half-Inch Silicon CVD Reactor Using Concentrated Infrared Light Heater (5)

〇NING LI1, HITOSHI HABUKA1, TAKANORI MIKAHARA2, SHIN-ICHI IKEDA2,3, YUUKI ISHIDA2,3, SHIRO HARA2,3 (1.Yokohama National Univ., 2.MINIMAL, 3.AIST)

Keywords:epitaxial growth

To develop a method for obtaining the uniform-thick silicon epitaxial film using the CVD reactor for minimal manufacturing with the new reflector, we studied the effect of a substrate rotation and a SiC susceptor. Because these methods suppressed the distribution of the substrate temperature, the film thickness tended to be symmetrical and uniform.