The 76th JSAP Autumn Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[13p-1C-1~15] 13.4 Si wafer processing /MEMS/Integration technology

Sun. Sep 13, 2015 1:15 PM - 5:15 PM 1C (135)

座長:鉄田 博(日新イオン機器),上野 和良(芝浦工大)

2:45 PM - 3:00 PM

[13p-1C-7] The depositional performance of the Al thin film in Minimal Sputtering System (Ⅲ)

〇Akihiko Kato1,3, Lan Kou2, Hisato Ogiso1,2, Shizuka Nakano1,2, Yuuki Yabuta1,3, Sommawan Khumpuang1,2, Shiro Hara1,2 (1.MINIMAL, 2.AIST, 3.Seinan)

Keywords:HiPIMS