Application of lithography in MINIMAL Package

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

Sun. Sep 13, 2015 1:15 PM - 5:15 PM 1C (135)

座長:鉄田博(日新イオン機器),上野和良(芝浦工大)

3:30 PM - 3:45 PM

〇yasuhide higashino¹, Fumito Imura^1,2, Michihiro Inoue², Arami Saruwatari^1,2, Sommawan Khumpuang^1,2, Shiro Hara^1,2 (1.MINIMAL, 2.AIST)

Keywords:minimal,Package,lithography