The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14a-1C-1~10] 13.4 Si wafer processing /MEMS/Integration technology

Mon. Sep 14, 2015 9:00 AM - 11:45 AM 1C (135)

座長:佐々木 実(豊田工大),石井 仁(豊橋技科大)

9:30 AM - 9:45 AM

[14a-1C-3] Vertically integrated flexible CMOS circuit with temperature sensor

〇Wataru Honda1, Shingo Harada1, Ishida Shohei1, Takayuki Arie1, Seiji Akita1 (1.Osaka Pre. Univ.)

Keywords:flexible device,vertical integration,temperature sensor

In this study, we realize a low power consumption CMOS circuit using carbon nanotube network thin film transistor(TFT) and InGaZnO TFT on a flexible substrate. And we propose a vertical integration of these TFTs and sensors to achive high integration tecqunics . In this report, we report electrical and mechanical characteristics of vertically integrated flexible CMOS circuit with temperature sensor.