The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14p-1C-1~16] 13.4 Si wafer processing /MEMS/Integration technology

Mon. Sep 14, 2015 1:15 PM - 5:30 PM 1C (135)

座長:中村 友二(富士通研),筑根 敦弘(大陽日酸)

5:00 PM - 5:15 PM

[14p-1C-15] By-product Formation in a SiHCl3-H2 System for Silicon Film Deposition

Ayumi Sakura1, Ayumi Saito1, 〇Hitoshi Habuka1 (1.Yokohama Nat. Univ.)

Keywords:Silicon,SiHCl3,By-product

Trichlorosilane is widely used for producing silicon epitaxial film. Its by-product, SiCl2 tends to adsorb at the inner surface of exhaust tube. This deposit is explosive and often actually causes serious accidents. Thus, its production mechanism is discussed, in this study. Following our previous report, which showed that SiCl2 in the gas phase increased with the decreasing the hydrogen gas concentration, the SiCl2 production mechanism is discussed.