[14p-1C-1~16] 13.4 Si wafer processing /MEMS/Integration technology

[14p-1C-2] Study on template release force in peeling release method

〇Takamitsu Tochino¹, Tatsuya Iida¹, Masaaki Yasuda¹, Hiroaki Kawata¹, Yoshihiko Hirai¹ (1.Osaka Pref. Univ.)

Keywords:Nano impint,Release force,Stress

Computational study was done for k-molding process by peel method in nanoimprint. The resist release starts at the bottom interface and the side wall at the other side of the rotation center. Due to asymmetric geometry, stress is concentrated and the reparation is enhanced. As a result, de-molding force is reduced.