The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14p-1C-1~16] 13.4 Si wafer processing /MEMS/Integration technology

Mon. Sep 14, 2015 1:15 PM - 5:30 PM 1C (135)

座長:中村 友二(富士通研),筑根 敦弘(大陽日酸)

2:15 PM - 2:30 PM

[14p-1C-5] Relationship between friction force and water behavior of PVA roller brushes on plates with different surface wettability

〇(M1)kenya nishio1, Toshiyuki Sanada1, Akira Hukunaga2, Hirokuni Hiyama2 (1.Shizuoka Univ., 2.Ebara Co.)

Keywords:semiconductor,PVA brush,Post CMP cleaning

In order to gain insight into the mechanisms of polyvinyl acetal (PVA) roller brush cleaning in semiconductor device fabrication, we measure the friction force between two types of roller brushes and several surfaces to evaluate the influence of surface wettability. In addition, contact and water behavior between nodule and surface was observed by high-speed video camera. When the roller brush with four rows nodule scrubs on large contact angle surface, the friction force also shows large value. In addition, the time series of friction force of single nodule also shows the different force curve depending on the surface wettability. High-speed photography indicates that the amount of water seeped out of nodule depends on the surface wettability. We believe that the water behavior during the nodule contacts play an important role for the PVA brush friction.