The 76th JSAP Autumn Meeting, 2015

Presentation information

Oral presentation

8 Plasma Electronics » 8.4 Plasma etching

[15a-2Q-1~12] 8.4 Plasma etching

Tue. Sep 15, 2015 9:00 AM - 12:15 PM 2Q (231-1)

座長:辰巳 哲也(ソニー),石川 健治(名大)

11:45 AM - 12:00 PM

[15a-2Q-11] Mechanism of transition metal etching process using neutral beam oxidation and complex reaction (3)

〇Tomohiro Kubota1, Yoshiyuki Kikuchi2, Toshihisa Nozawa2, Hiroshi Ito3, Momoji Kubo3, Seiji Samukawa1,4 (1.IFS, Tohoku Univ., 2.Tokyo Electron Ltd., 3.IMR, Tohoku Univ., 4.WPI-AIMR, Tohoku Univ.)

Keywords:transition metal,Magnetoresistive RAM,etching process

Anisotropic etching of transition metals (especially magnetic materials) is important for realization of MRAM. Recently Gu and Samukawa reported a damage-free anisotropic etching of transition metals using neutral beam and transition metal complex. The etching mechanism was investigated based on first-principles calculation.