The 76th JSAP Autumn Meeting, 2015

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[15a-PB4-1~9] 13.4 Si wafer processing /MEMS/Integration technology

Tue. Sep 15, 2015 9:30 AM - 11:30 AM PB4 (Shirotori Hall)

9:30 AM - 11:30 AM

[15a-PB4-3] An Evaluation on Adhesion Strength with Metal Structure for MEMS Accelerometer

〇TERUAKI SAFU1, Toshifumi Konishi1, Takaaki Matsushima1, Daisuke Yamane2,4, Hiroshi Toshiyoshi3,4, Masato Sone2,4, Kazuya Masu2,4, Katsuyuki Machida1,2,4 (1.NTT-AT Corp, 2.Tokyo Tech, 3.The Univ. of Tokyo, 4.JST-CREST)

Keywords:MEMS,accelerometer

We study on the integrated MEMS accelerometer with multi-layered metal by using gold electroplating for high resolution and wide detection range. Mechanical components of MEMS accelerometer consist of the proof mass, suspensions, electrode, and stopper. We proposed the stopper structure to avoid the self-destruction by over-swinging. In this work, we investigated the mechanical strength of the stopper on the view point of sticking force of metal layers. Experimental results showed that our proposed stopper had a possibility to be over 100 G input acceleration.