The 62nd JSAP Spring Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 9:00 AM - 12:30 PM A29 (6A-204)

9:00 AM - 9:15 AM

[11a-A29-1] Characteristics of PVD-Co(W) film for highly reliable ULSI-Cu interconnect

〇Takeshi Momose1, Kota Tomita1, Takaaki Tsunoda2, Takashi Nakagawa2, Yukihiro Shimogaki1 (1.The Univ. of Tokyo, 2.CANON ANELVA)

Keywords:Cu interconnect,Co(W),PVD