The 62nd JSAP Spring Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 9:00 AM - 12:30 PM A29 (6A-204)

9:45 AM - 10:00 AM

[11a-A29-4] Printing deposition of thin Cu films using nanosilicon ballistic electron emtter

〇Ryutaro Suda1, Mamiko Yagi1, Akira Kojima1, Romain Mentek1, Jun-ichi Shirakashi1, Nobuyoshi Koshida1 (1.Tokyo Univ. of Agri. & Technol.)

Keywords:electron emitter,thin film deposition,reduction