Development of a Printing plus Plating Method for a Low Resistant Cu Metallization

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 9:00 AM - 12:30 PM A29 (6A-204)

10:00 AM - 10:15 AM

〇HIDEO TOKUHISA¹, MITSURU TOMITA¹, SATOKO MORITA¹, SHOGO ISE¹, SHIHO TSUKAMOTO¹ (1.AIST)

Keywords:Cu electrode,Screen Printing,Plating