[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

[11a-A29-7] Process Issues in Optical Integrated Circuits using Silicon Photonics Technology (II) Process Integration and Assembly of Optical Modules

〇Keizo Kinoshita¹, Tsuyoshi Horikawa^{1, 2}, Shigekazu Okumura¹, Koichi Takemura¹, Takanori Shimizu¹, Junichi Fujikata¹, Tohru Mogami¹ (1.PETRA, 2.AIST)

Keywords:silicon photonics,optical integrated circuits,deep etching