The 62nd JSAP Spring Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11a-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 9:00 AM - 12:30 PM A29 (6A-204)

11:00 AM - 11:15 AM

△ [11a-A29-8] Dioxide filled deep silicon-trenches for through-silicon via silicon island arrays

〇Yasuyuki Uraoka1, Hideo Oi2, Makoto Ishida1, 2, Takeshi Kawano1 (1.Electrical and Electronic Information Engineering, Toyohashi Tech., 2.EIIRIS, Toyohashi Tech.)

Keywords:TSV,SOI processes and devices,packaging