The 62nd JSAP Spring Meeting, 2015

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13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[11p-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology

Wed. Mar 11, 2015 2:00 PM - 5:30 PM A29 (6A-204)

5:15 PM - 5:30 PM

[11p-A29-13] Development of a Water Film Chuck for High Precision Thin Grinding

〇Kenichiro Yoshitomi1, Atsunobu Une1, Masaaki Mochida1, Banto Tsubasa2, Eiichi Yamamoto2 (1.NDA, 2.Okamoto machine tool works)

Keywords:Silicon wafer,Thin grinding,Chuck