5:00 PM - 5:15 PM
[11p-A29-12] Wafer-level Hermetic Bonding using Gold Bumps Planarized by Fly Cutting
Keywords:MEMS,Integration,Bonding
Presentation information
Oral presentation
13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology
[11p-A29-1~13] 13.4 Si wafer processing /MEMS/Integration technology
Wed. Mar 11, 2015 2:00 PM - 5:30 PM A29 (6A-204)