[13a-A23-1~10] 13.5 Semiconductor devices and related techologies

[13a-A23-7] [Silicon Technology Division Award Speech] Three-Dimensional Integrated Circuits Using Au/SiO₂ Hybrid Bonding

〇Masahide Goto¹, Kei Hagiwara¹, Yoshinori Iguchi¹, Hiroshi Ohtake¹, Takuya Saraya², Eiji Higurashi², Hiroshi Toshiyoshi², Toshiro Hiramoto² (1.NHK, 2.Univ. of Tokyo)

Keywords:3D integrated circuit,bonding,SOI