The 62nd JSAP Spring Meeting, 2015

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Poster presentation

12 Organic Molecules and Bioelectronics » 12.1 Fabrications and Structure Controls

[13a-P13-1~27] 12.1 Fabrications and Structure Controls

Fri. Mar 13, 2015 9:30 AM - 11:30 AM P13 (Gymnasium)

9:30 AM - 11:30 AM

[13a-P13-4] Preparation of Copper Seed Layer by Ionization-Assisted Deposition on Polyimide

〇Tomoki Kohno1, Kuniaki Tanaka1, Hiroaki Usui1 (1.Tokyo Univ. Agricul. & Technol.)

Keywords:seed layer,Flexible printed circuits,vapor deposition