[13a-P14-1~14] 13.4 Si wafer processing /MEMS/Integration technology

△ [13a-P14-11] Interface characteristics of Si/Si junctions by using surface-activated bonding

〇(B)shoji yamajo¹, masashi morimoto¹, jianbo liang¹, naoteru shigekawa¹ (1.Osaka City Univ.)

Keywords:interface states,surface-activated bonding,annealing