The 62nd JSAP Spring Meeting, 2015

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Poster presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[13a-P14-1~14] 13.4 Si wafer processing /MEMS/Integration technology

Fri. Mar 13, 2015 9:30 AM - 11:30 AM P14 (Gymnasium)

9:30 AM - 11:30 AM

[13a-P14-7] Evaluation of Resistance for Chip on Chip Bonding using "AlSi/TiN" bumps with ACP

〇Masahiro Akiyama1, Dali Zhang2, Myung-Jae Lee2, Edoardo Charbon2 (1.NIT, Nagano College, 2.TUDelft)

Keywords:ACP,bump,Resistance