[14a-A29-1~11] 13.4 Si wafer processing /MEMS/Integration technology

[14a-A29-7] A New Application of Laser Annealing for High-Performance Power MOSFET

〇YI CHEN¹, TAKASHI NOGUCHI¹, FULVIO MAZZAMUTO², KARIM HUET² (1.University of the Ryukyus, 2.SCREEN Semiconductor Solutions Co., Ltd.)

Keywords:laser annealing,shallow junction,characteristics of the shallow junction