The 62nd JSAP Spring Meeting, 2015

Presentation information

Oral presentation

13 Semiconductors » 13.4 Si wafer processing /MEMS/Integration technology

[14a-A29-1~11] 13.4 Si wafer processing /MEMS/Integration technology

Sat. Mar 14, 2015 9:00 AM - 12:00 PM A29 (6A-204)

10:45 AM - 11:00 AM

[14a-A29-7] A New Application of Laser Annealing for High-Performance Power MOSFET

〇YI CHEN1, TAKASHI NOGUCHI1, FULVIO MAZZAMUTO2, KARIM HUET2 (1.University of the Ryukyus, 2.SCREEN Semiconductor Solutions Co., Ltd.)

Keywords:laser annealing,shallow junction,characteristics of the shallow junction