Application of Phonon Engineering to Electronics Packaging

○Tomoyuki Hatakeyama

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Special Symposium

Special Symposium » PHONON ENGINEERING: material science, theory/simulation and measurement technologies for Nano-scale thermal management and device innovation

[14a-B2-1~15] PHONON ENGINEERING: material science, theory/simulation and measurement technologies for Nano-scale thermal management and device innovation

Sat. Mar 14, 2015 8:45 AM - 3:00 PM B2 (6B-102)

2:25 PM - 2:50 PM

[14a-B2-14] Application of Phonon Engineering to Electronics Packaging

○Tomoyuki Hatakeyama¹, Masaru Ishizuka¹ (1.Toyama Prefectural Univ. )

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