Session information

Special Symposium

Special Symposium » PHONON ENGINEERING: material science, theory/simulation and measurement technologies for Nano-scale thermal management and device innovation

[14a-B2-1~15] PHONON ENGINEERING: material science, theory/simulation and measurement technologies for Nano-scale thermal management and device innovation

Sat. Mar 14, 2015 8:45 AM - 3:00 PM B2 (6B-102)

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8:45 AM - 8:55 AM

[14a-B2-1] Introductory talk

○Yuji Awano¹ (1.Keio Univ.　)

8:55 AM - 9:20 AM

[14a-B2-2] Controlling Phonon Transport by Nanostructures and Interfaces

○Junichiro Shiomi^1,² (1.The Univ. of Tokyo, 2.JST PRESTO)

9:20 AM - 9:45 AM

[14a-B2-3] Candidate low thermal conductivity materials based on minimum thermal conductivity

○Yukari Katsura¹, Hidenori Takagi^1,², Atsushi Oshiyama¹ (1.The Univ. of Tokyo, 2.MPI )

9:45 AM - 10:10 AM

[14a-B2-4] Thermal conduction control using wave nature of phonons

○Masahiro Nomura^1,² (1.IIS and Nanoquine, 2.The Univ. of Tokyo )

10:10 AM - 10:35 AM

[14a-B2-5] Numerical Analyses of Lattice Thermal Conduction in Oxides with Complicated Crystal Structure by Perturbed Molecular Dynamics

○Masaato Yoshiya^1,², Susumu Fujii¹, Yohei Miyauchi¹, Masahiro Tada¹, Tomoya Nagira¹, Hideyuki Yasuda^1,³ (1.Osaka Univ., 2.Japan Fine Ceramics Center, 3.Kyoto Univ.)

10:35 AM - 11:00 AM

[14a-B2-6] Heat Conduction in a Porous Si Thin Film

○Koji Miyazaki¹ (1.Kyushu Inst. of Tech. )

11:00 AM - 11:25 AM

[14a-B2-7] Heat conduction in thin films and at interfaces observed by pulsed light heating thermoreflectance technique

○Takashi Yagi¹, Naoyuki Taketoshi¹, Tetsuya Baba¹ (1.AIST )

11:25 AM - 11:50 AM

[14a-B2-8] Thermoelectrics; from the material standpoint

○Takao Mori^1,² (1.NIMS, 2.Univ. Tsukuba )

11:50 AM - 12:15 PM

[14a-B2-9] NEMS technologies and phonon engineering

○Hiroshi Mizuta^1,², Manoharan Muruganathan¹, Mikio Koyano¹, Yoshishige Tsuchiya² (1.JAIST, 2.Univ. Southampton)

12:15 PM - 1:00 PM

[14a-B2-9.1] Lunch

1:00 PM - 1:10 PM

[14a-B2-10] Nano-Scale Thermal Management for Device Innovation

○Toshio Baba¹, Hiroaki Saito¹, Katsuaki Sato¹, Toshiki Nagano¹, Nobuhiro Matsushita¹, Masanori Matoba¹, Jun’ichi Sone¹ (1.JST- CRDS )

1:10 PM - 1:35 PM

[14a-B2-11] Nanoscale thermal control in resistive random access memory (ReRAM)

○Hiroyuki Akinaga¹, Hisashi Shima¹ (1.AIST-NeRI)

1:35 PM - 2:00 PM

[14a-B2-12] Thermally Assisted Magnetic Recording Applying Surface Plasmon

○Katsuji Nakagawa¹, Yoshito Ashizawa¹, Arata Tsukamoto¹ (1.Nihon Univ. )

2:00 PM - 2:25 PM

[14a-B2-13] Thermal-aware Design of Nanoscale Devices to Improve Performance and Functionality

○Ken Uchida^1,², Tsunaki Takahashi^1,² (1.Keio Univ., 2.JST-CREST )

2:25 PM - 2:50 PM

[14a-B2-14] Application of Phonon Engineering to Electronics Packaging

○Tomoyuki Hatakeyama¹, Masaru Ishizuka¹ (1.Toyama Prefectural Univ. )

2:50 PM - 3:00 PM

[14a-B2-15] Closing remarks

○Shigeo Maruyama¹ (1.The Univ. of Tokyo　)

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