Takahiro Mitsuishi

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Speaker, Author, Co-Author

Wed. Sep 14, 2016 1:30 PM - 3:30 PM P5 (Exhibition Hall)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[14p-P5-1~13] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

1:30 PM - 3:30 PM

[14p-P5-6] Evaluation of resister characteristics for chip on chip bonding using "AlSi/TiN" bumps and concave shape electrode with ACP

〇(B)Takahiro Mitsuishi¹, Masahiro Akiyama¹, Dali Zhang², Myung-Jae Lee², Edoardo Charbon² (1.NIT, 2.TUDelft)