Katsuya Furuna

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Speaker, Author, Co-Author

Thu. Sep 15, 2016 1:45 PM - 6:30 PM B10 (Exhibition Hall)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[15p-B10-1~17] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

6:00 PM - 6:15 PM

[15p-B10-16] Electrical characteristics of Cu foil/Si junctions by using surface activated bonding

〇Katsuya Furuna¹, Jianbo Liang¹, Moeko Matsubara², Marwan Dhamrin², Yoshitaka Nishio², Naoteru Shigekawa¹ (1.Osaka City Univ., 2.Toyo Aluminium K.K.)