6:30 PM - 6:45 PM
[14p-D61-19] Fabrication method of superconducting TSV for STJ detector using 3D integration technique
Keywords:Superconducting Tunnel Junction, Through Si Via, Three-Dimensional structure
Oral presentation
11 Superconductivity » 11.4 Analog applications and their related technologies
Wed. Sep 14, 2016 1:15 PM - 7:00 PM D61 (Bandaijima Bldg.)
Toshihiko Kiwa(Okayama Univ.), Shigehito Miki(NICT), Tohru Taino(Saitama Univ.)
6:30 PM - 6:45 PM
Keywords:Superconducting Tunnel Junction, Through Si Via, Three-Dimensional structure