Flip chip bonding for STJ detector using 3D integration technique

Souki Hatakeyama; Kohei Morita; Shunsuke Nemoto; Katsuya Kikuchi; Hiroshi Nakagawa; Masahiro Aoyagi; Masato Naruse; Hiroaki Myoren; Tohru Taino

Presentation information

Oral presentation

11 Superconductivity » 11.4 Analog applications and their related technologies

[14p-D61-1~20] 11.4 Analog applications and their related technologies

Wed. Sep 14, 2016 1:15 PM - 7:00 PM D61 (Bandaijima Bldg.)

Toshihiko Kiwa(Okayama Univ.), Shigehito Miki(NICT), Tohru Taino(Saitama Univ.)

6:45 PM - 7:00 PM

[14p-D61-20] Flip chip bonding for STJ detector using 3D integration technique

〇(M1)Souki Hatakeyama¹, Kohei Morita¹, Shunsuke Nemoto², Katsuya Kikuchi², Hiroshi Nakagawa², Masahiro Aoyagi², Masato Naruse¹, Hiroaki Myoren¹, Tohru Taino¹ (1.Saitama Univ., 2.AIST)

Keywords:flip chip bonding

« Previous in this session
Next in this session »

▲