The 77th JSAP Autumn Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[14p-P5-1~13] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Wed. Sep 14, 2016 1:30 PM - 3:30 PM P5 (Exhibition Hall)

1:30 PM - 3:30 PM

[14p-P5-3] A Study on Multi-layer Metal MEMS Accelerometer with Differential Sensing Structure

Daisuke Yamane1,4, Toshifumi Konishi2, Teruaki Safu2, Hiroyuki Ito1,4, Shiro Dosho1,4, Noboru Ishihara1,4, Masato Sone1,4, Hiroshi Toshiyoshi3,4, Kazuya Masu1,4, Katsuyuki Machida2,4 (1.Tokyo Tech., 2.NTT-AT, 3.The Univ. of Tokyo, 4.JST-CREST)

Keywords:MEMS, accelerometer, differential sensing structure