The 77th JSAP Autumn Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[14p-P5-1~13] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Wed. Sep 14, 2016 1:30 PM - 3:30 PM P5 (Exhibition Hall)

1:30 PM - 3:30 PM

[14p-P5-9] Aluminium-assisted chemical vapor etching of silicon dioxide, and its characterization

Reo Kometani1, Takahiro Murakami1, Etsuo Maeda1 (1.The Univ. of Tokyo)

Keywords:Metal-assisted chemical vapor etching, Aluminium, Silicon dioxide

In this study, the etching characteristics and chemical-bonding state were evaluated in order to clarify the etching mechanism of a metal-assisted chemical etching of SiO2 using Al. As a result, the etching speed with Al was 14 times faster than it without Al, and we confirmed that the Al enhanced the VHF chemical etching. In addition to this, we found that the enhancement of the etching speed on Al-assisted VHF chemical etching was induced by the local density increasing of HF on neighborhood of Al.