[15p-P6-1~16] 8.3 deposition of thin film and surface treatment

△ [15p-P6-3] Formation of Cu Film by Applying RF Substrate Bias to Ion Beam Sputtering Using ECR-MW Plasma Source

〇Toru Harigai¹, Masafumi Yamano¹, Takahiro Imai¹, Yushi Iijima¹, Ryo Isono¹, Yoshiyuki Suda¹, Hirofumi Takikawa¹ (1.Toyohashi Univ. Technol.)

Keywords:ion beam sputtering, RF plasma, metal film