Takahide Murayama

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Speaker, Author, Co-Author

Sat. Mar 19, 2016 2:30 PM - 5:45 PM W621 (W6)

Oral presentation
| 8 Plasma Electronics
| 8.4 Plasma etching

[19p-W621-1~12] 8.4 Plasma etching

5:30 PM - 5:45 PM

[19p-W621-12] Dry Desmear technology for High-density Packaged PCB.

Muneyuki Satou¹, Yasuhiro Morikawa¹, 〇Takahide Murayama¹, Noriaki Tani¹, Yoneda Masahiro¹ (1.ULVAC, Inc.)