SEIYA TANIKAWA

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Speaker, Author, Co-Author

Sun. Mar 20, 2016 9:00 AM - 12:15 PM S423 (S4)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[20a-S423-1~9] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

9:00 AM - 9:15 AM

△ [20a-S423-1] Evaluation of Local Bending Stress Effects on 3DIC with Retention Time Measurement of DRAM Cell Array

〇SEIYA TANIKAWA¹, HISASHI KINO², TAKAFUMI FUKUSHIMA¹, TETSU TANAKA^1,3 (1.Dept. Bioengineering and Robotics, Tohoku Univ., 2.FRIS, Tohoku Univ., 3.Dept. of Biomedical Engineering, Tohoku Univ.)

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