Kenichi Nakadozono

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Speaker, Author, Co-Author

Sun. Mar 20, 2016 9:00 AM - 12:15 PM S423 (S4)

Oral presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[20a-S423-1~9] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

9:15 AM - 9:30 AM

△ [20a-S423-2] In-Situ Observation of Strain and Temperature in Flip Chip Ultrasonic Bonding

〇(M1)Kenichi Nakadozono¹, Keiichiro Iwanabe¹, Yousuke Senda¹, Tanemasa Asano¹ (1.Kyushu Univ.)