BoLun Zheng

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Speaker, Author, Co-Author

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P17 (Gymnasium)

Poster presentation
| 13 Semiconductors
| 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

4:00 PM - 6:00 PM

△ [21p-P17-22] Study of Grain Boundary on Mechanical Properties of Aluminum Alloy Investigated by Micro Compression Test

〇BoLun Zheng¹, Takashi Nagoshi^1,2, Tso-Fu Mark Chang¹, Hideki Hosoda¹, Tatsuo Sato¹, Masato Sone¹ (1.Tokyo Tech., 2.AIST)