[19p-P8-1~1] 8.8 Plasma Electronics English Session

▼ [19p-P8-1] Development of High-Density RF Magnetized Sputtering Plasma Source with Square-Shaped Arrangement of Magnets for Uniform Target Utilization

〇(D)MD AMZAD HOSSAIN^1,2,3, Koichirou Ikari¹, Tsubasa Ide¹, Yasunori Ohtsu¹ (1.Saga University, 2.JesUni SciTech, 3.RajUniv EngTech)

Keywords:square-shaped,uniform-target,iron(Fe)-cover

We have developed a high-density RF magnetized sputtering plasma source with square-shaped magnet arrangement for uniform target utilization. In this work, influence of magnetic field schemes under target has been investigated from the point of view target uniform utilization and high-density plasma. The practical experiments are done in stainless-steel cylindrical vacuum chamber with outer diameter 235 mm, inner diameter 160 mm and 195 mm in length. Practical experimental conditions are Argon (Ar) gas pressure of 1.03 [Pa], and RF input power of 50 [W] at 13.56 [MHz]. The proposed square-shaped magnet arrangement is shown in Fig. 1. Eight Neodymium rod magnets of 30 mm×5 mm×3 mm are mounted on a circular iron yoke. The iron yoke is set up with a gap of 1 mm from the copper target plate. Copper sputtering is done by rotating the iron yoke with speed of 40 [rpm] and experimental time duration of 4 hours. The radial profiles of ion saturation current, target erosion depth and percent of utilization, plasma density, horizontal magnetic flux density, RF discharge voltage, and self-biased dc voltage on the cathode have been investigated for (a) with iron (Fe) cover, no air gap (b) without iron (Fe) cover, no air gap respectively. It was found from simulation that magnetic shielding material, iron covers suppress the horizontal magnetic flux density. The E×B drift motion in center direction in Fig. 1 is prohibited by magnetic shielding material, iron cover of 1 mm thickness. Fig. 2 shows radial profiles of copper target erosion depth. The target utilization percentage is increased from 74.43% to 84.82% by using the magnetic shielding iron (Fe) cover. This indicates that the target erosion depth rate as well as copper thin film deposition rate for functional thin film preparation will increase by means of magnetic shielding iron (Fe) cover.