The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

8 Plasma Electronics » 8.4 Plasma etching

[19p-W621-1~12] 8.4 Plasma etching

Sat. Mar 19, 2016 2:30 PM - 5:45 PM W621 (W6)

Hisataka Hayashi(TOSHIBA), Koji Eriguchi(Kyoto Univ.)

5:15 PM - 5:30 PM

[19p-W621-11] Study of etching mechanism of transition metal using neutral beam enhanced complex reaction based on tight-binding quantum chemical molecular dynamics

Tomohiro Kubota1, Hiroshi Ito2, Momoji Kubo2, Seiji Samukawa1,3 (1.IFS, Tohoku Univ., 2.IMR, Tohoku Univ., 3.WPI-AIMR, Tohoku Univ.)

Keywords:transition metal complex,magnetoresistive RAM,etching process

Anisotropic etching of transition metals (especially magnetic materials) is important for realization of MRAM. Recently Gu and Samukawa reported a damage-free anisotropic etching of transition metals using neutral beam and transition metal complex. The etching mechanism was investigated based on tight-binding quantum chemical molecular dynamics.