The 63rd JSAP Spring Meeting, 2016

Presentation information

Oral presentation

3 Optics and Photonics » 3.9 Terahertz technologies

[20a-H135-1~12] 3.9 Terahertz technologies

Sun. Mar 20, 2016 9:00 AM - 12:15 PM H135 (H)

Masatsugu Yamashita(RIKEN), Safumi Suzuki(Titech)

10:00 AM - 10:15 AM

[20a-H135-5] Fabrication of Integrated Optical to Terahertz Signal Converter

Akio Yasui1, Satoshi Yamasaki1, Tomohiro Amemiya2, Kentaro Furusawa3, Shinsuke Hara3, Issei Watanabe3, Norihiko Sekine3, Nobuhiko Nishiyama1, Akifumi Kasamatsu3, Shigehisa Arai1,2 (1.TokyoTech, 2.QNERC, 3.NICT)

Keywords:Optical to Terahertz conversion,Terahertz,Optical Communication

We demonstrated the first operation of an on-chip integrated optical-to-terahertz signal converter using ring-shaped microstrip line with GaInAs photoconductive mesa structure. The proposed device directly converted the long-wavelength communication band optical signal to 300GHz teraherts signal. As a results, the device successfully performed 16.5dB extinction ratio at input optical power of 32 mW.