[21a-W321-1~12] 3.7 Laser processing

[21a-W321-4] Fabricaton of Through Si Vias by 1.5 μm Femtosecond Bessel Beams

Fei He^1,2, Ya Cheng², 〇Koji Sugioka¹ (1.RIKEN, 2.SIOM)

Keywords:femtosecond laser processing,Bessel beam,through Si via

Current 3D ICs rely on the 3D assembly of Si chips, of which a key technology is the fabrication of through-Si vias (TSVs). In this talk, we propose the technique fabricating taper-free, high-aspect-ratio TSVs with micron-sized diameters using 1.5 μm femtosecond Bessel beams. Additionally, to suppress the inherent sidelobe damage caused by fs Bessel beams, we tailor the Bessel beam by using the binary phase plates (BPPs).