The 63rd JSAP Spring Meeting, 2016

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

[21p-P17-1~26] 13.4 Si wafer processing /Si based thin film /MEMS/Integration technology

Mon. Mar 21, 2016 4:00 PM - 6:00 PM P17 (Gymnasium)

4:00 PM - 6:00 PM

[21p-P17-26] Second Research Prototype of Schottky Diode for Energy Harvesting

Akihira Miyachi1, Makoto Matsunoshita1, Ryoko Kishikawa2,3, Satoshi Yoshida4, Makoto Kasu5, Masahiro Horibe3, Kenjiro Nishikawa4, Iwamuro Mitsunori6, Shigeo Kawasaki1,2 (1.ISAS,JAXA, 2.Sokendai, 3.AIST, 4.Kagosima Univ, 5.Saga Univ, 6.Hitachi Chem. Co.,Ltd.)

Keywords:Schottky barrier diode,Thermal diffusion

We research and develop the HySIC((Hybrid Semiconductor Integrated Circuit) using CMOS device with RF switch and turning circuit. For realizing CMOS devices, we studied a schottky barrier diode as a first step. In this study, We used high-resistivity silicon and boron sources in a thermal diffusion process.