[21p-P9-1~9] 15.5 Group IV crystals and alloys

[21p-P9-4] Cu-induced poly-crystallization of electrodeposited Ge film on flexible substrate

〇Yasutaka Uchida¹, Tomoko Funayama¹, Yoshiaki Kogure¹, Wenchang Yeh² (1.Teikyo Univ. of Sci., 2.Shimane Univ.)

Keywords:germanium,poly-crystallization,stress

We have reported on the deposition of electrodeposited Ge film on the glass substrate and also reported Cu-induced poly-crystallization. In this presentation we would like to report on the poly-crystallization technique to Ge film deposited on flexible substrate. It was observed by the poly-crystallized Ge film that the Cu/Ti/Neopulim structure curved to become the convex. Stress of the Ge film was calculated by Stoney’s equation. The stress was about 0.5GPa.