Susumu Obata

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Speaker, Author, Co-Author

Thu. Sep 7, 2017 1:45 PM - 5:25 PM C19 (C19)

Symposium (Oral)
| Symposium
| Challenges for 'multi-scale' processing - dry, wet, or else?...

[7p-C19-1~10] Challenges for 'multi-scale' processing - dry, wet, or else?...

5:05 PM - 5:20 PM

[7p-C19-9] A Novel Wafer Dicing Method Using Metal-Assisted Chemical Etching

〇Susumu Obata¹, Keiichiro Matsuo¹, Mitsuo Sano¹, Kazuhito Higuchi¹, Kazuo Shimokawa¹, Tsuyoshi Sato¹ (1.Toshiba Corporation)