9:00 AM - 9:15 AM
[6a-C14-1] Single Step ICP (Inductively Coupled Plasmas) Dry-Etching Condition for Lateral pin Waveguide
Keywords:PIN structure, RIE-lag effect, Trench structure
RIE lag phenomenon in inductively coupled plasmas was investigated to realize lateral pin waveguide with single step dry-etching. More than 10% etching speed reduction has been confirmed at an open space of 0.8μm, compared to the case of open space of 5μm clearly under ICP bias power (ion acceleration power) of 100W.