[6p-C11-1~14] 12.3 Functional Materials and Novel Devices

△ [6p-C11-3] Quantitative Method for Bending Analysis Using Light Diffraction Enables Evaluation of Surface Strain in Flexible Substrates

〇Ryo Taguchi¹, Yamada Kohei¹, Akamatsu Norihisa¹, Fujikawa Shigenori^1,2, Shishido Atsushi^1,3 (1.Lab. for Chem. & Life Sci., Tokyo Tech., 2.WPI-I2CNER, Kyushu Univ., 3.PRESTO, JST)

Keywords:flexible devices, bending, surface strain

Mechanical analysis and deformation behavior of flexible materials is essential for designing high-performance devices for applications such as wearable electronics, soft robotics. Although, surface strain under bending that is an important mechanical characteristic for device performance, there are few techniques to directly, quantitatively evaluate the strain. Recently, we have proposed a facile method to analyze a surface strain in a quantitative and non-destructive way using diffraction of light. Here we report a quantitative analysis of surface strain of flexible films under bending and investigation of the relation between surface strain and radii of curvature.