[8p-A410-1~10] 4.8 Strong Light Excitation Phenomena Applied to Materials and Bio Engneering

▲ [8p-A410-1] [JSAP-OSA Joint Symposia 2017 Invited Talk] Tailored Femtosecond Bessel Beam Processing - Application to Through Si Vias for 3D Si ICs -

〇Koji Sugioka¹, Fei He^1,2, Ya Cheng² (1.RIKEN RAP, 2.SIOM, CAS)

Keywords:femtosecond Bessel beam, Tailored beam processing, through Si hole

We propose to employ femtosecond 1.5-um Bessel beams tailored with specially designed binary phase plates for high-speed fabrication of high-quality, high-aspect-ratio through Si holes for 3D Si IC application. 2D array of through Si holes with an aspect ratio of ~15 in a 100-um-thick Si substrate without any sidelobe damage was successfully fabricated by the proposed technique. Our technique is potentially applicable for 3D assembly in the manufacturing of 3D Si ICs.