The 78th JSAP Autumn Meeting, 2017

Presentation information

Poster presentation

13 Semiconductors » 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

[8p-PA2-1~19] 13.4 Si wafer processing /Si based thin film /Interconnect technology/ MEMS/ Integration technology

Fri. Sep 8, 2017 1:30 PM - 3:30 PM PA2 (P)

1:30 PM - 3:30 PM

[8p-PA2-13] A Study of Long-Term Vibration Characteristics of MEMS Accelerometers Fabricated by Au Electroplating

Daisuke Yamane1,3, Toshifumi Konishi1,2,3, Teruaki Safu2, Koichiro Tachibana1,3, Minami Teranishi1,3, Chun-Yi Chen1,3, Tso-Fu Mark Chang1,3, Masato Sone1,3, Katsuyuki Machida1,3, Kazuya Masu1,3 (1.Tokyo Tech., 2.NTT-AT, 3.JST-CREST)

Keywords:MEMS accelerometer, gold electroplating, long-term vibration